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Capabilities
Circuit Card Assembly »
Cable Harness Assembly
Electro-Mechanical & System Integration
Functional & In Circuit Test		 Capabilities » Circuit Card Assembly

Kuchera Defense Systems possess the capabilities to accept and process a variety of orders for Circuit Card Assemblies. From single prototypes to large scale production runs. From through-hole to mixed technology, meeting the requirements of J-STD-001 and IPC-610 class 3, to the latest cutting edge SMT orders, utilizing State-of-the-art CNC equipment. KDS has the capability to manufacture CCA assemblies requiring any type of SMT component placements, including:
  • 01005
  • 0201
  • UBGA
  • BGA (placement from .08 mil to highest I/O count)
  • leadless chip carrier
  • ultra fine pitch

Kuchera Defense Systems utilizes the latest Selective Solder equipment for a repeatable process on mixed technology assemblies that meets all requirements of J-STD-001 and IPC – 610 class 3.
Mixed Technology Through-hole Technology

Surface-mount Technology
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