Manufacturing capabilities include: Surface-mount placement equipment with a total placement capacity of 148,000 components per hour BGA, micro BGA, Fine pitch, 0201 assembly, repair, x-ray, test, and rework capability Single or double sided, multi-layer or high mix PWB assemblies 100% SMT, Through Hole, mixed technology or hybrid circuit card assembly Hot air convection surface mount solder re-flow Automated thru-hole lead forming / trimming CNC wave solder system Digitally controlled mini wave solder Fully Automated in-circuit and functional test capabilities Automated Optical Inspection equipment System and component analysis equipment to aid in troubleshooting Fully equipped hand-place /assembly stations Bonding/potting equipment including scales and vacuum de-gassing system Automated/high speed and manual wire cut and strip equipment Hot stamp and laser-jet wire marking systems Shrink sleeve marking /permitizer machines Mechanical and pneumatic/auto feed crimp equipment Soldering stations (solder, de-solder, heat guns, solder pots) Connector torque tools Manual and automated point-to-point & insulation resistance test equipment Mechanical pull test equipment Hydraulic lifts / material handling equipment Electro-Mechanical Assembly equipment Black Box assembly and integration Chassis panel assemblies For technical questions regarding Kuchera's manufacturing capabilities, contact either: Director of Operations, George Bohrer at: bohrer@kuchera.com or SMT Manager, Russ Gouse at: gouse@kuchera.com.